Senior Mechanical Design Engineer

About the role

Filtronic is seeking a Senior Mechanical Design Engineer to lead the mechanical development of advanced RF and microwave products, from concept through to high‑volume production. You will work with experienced engineers and state‑of‑the‑art design tools to create high‑frequency modules that meet stringent performance, reliability and cost targets.

Key responsibilities

• Lead the design of precision mechanical components and assemblies for RF modules, including lightweight enclosures, heatsinks, liquid‑cooling systems and waveguide architectures.
• Develop modular mechanical architectures that integrate into larger payload or system‑level assemblies, addressing mass, volume, mounting and serviceability.
• Ensure designs satisfy RF, thermal, mechanical and environmental requirements such as EMI shielding, stiffness, tolerance control, CTE compatibility, vibration, shock and ingress protection.
• Create and review detailed 3D CAD models and engineering drawings using SolidWorks.
• Select appropriate materials, finishes and manufacturing processes to optimise performance, reliability and manufacturability.
• Lead or support thermal analysis (CFD, conjugate heat transfer) and structural analysis (FEA) to validate cooling strategies and mechanical robustness.
• Mentor junior engineers, provide technical guidance during design reviews and drive best‑practice mechanical design processes.

Required profile

• Proven senior‑level experience in mechanical design for high‑frequency RF or microwave systems.
• Strong understanding of thermal management, vibration, shock and environmental testing for high‑reliability applications, including space‑related payloads.
• Ability to translate analysis results into practical design improvements.
• Excellent communication skills to support cross‑functional teams and mentor less experienced engineers.

Required skills

• SolidWorks for 3D CAD modelling and drawing creation.
• Computational Fluid Dynamics (CFD) and conjugate heat transfer simulation.
• Finite Element Analysis (FEA) for structural, vibration and shock assessment.
• Thermal analysis of high‑power RF amplifiers and electronic assemblies.