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PCB Layout Engineer – High‑Frequency Systems

Filtronic · Sedgefield

🇬🇧 English
Altium Designer Altium 365 controlled impedance signal integrity power integrity thermal design EMC Ethernet DDR LVDS PCIe JESD204 component footprints PCB fabrication SMT assembly DFM/DFA

Job description

About the role

Filtronic is seeking an experienced PCB Layout Engineer to join its Cambridge engineering team. You will work on complex high‑frequency electronic systems, collaborating with RF, electronics, mechanical, FPGA, software and manufacturing engineers to deliver robust, manufacturable hardware from concept to production.

Key responsibilities

  • Own PCB layout activities for complex electronic products and subsystems.
  • Translate schematics into high‑quality PCB layouts that meet electrical, mechanical, thermal and manufacturing requirements.
  • Develop layouts with impedance control, grounding, power distribution, thermal management and EMC performance.
  • Support high‑speed digital interfaces such as Ethernet, DDR, LVDS, PCIe and JESD204.
  • Generate complete fabrication, assembly and manufacturing documentation packages.
  • Participate in design reviews, DFM/DFA assessments and engineering risk reviews.
  • Verify component footprints, symbols and libraries against manufacturer datasheets.
  • Improve Altium libraries, templates, design rules and PCB standards.
  • Work with suppliers and manufacturing partners to resolve design and production challenges.
  • Support prototype build, bring‑up and investigation of PCB‑related issues.

Required profile

  • Detail‑oriented engineer with a passion for developing high‑performance electronic hardware.
  • Proven experience taking PCB designs from schematic through to manufacturing release.
  • Strong understanding of PCB stack‑up, controlled impedance, signal and power integrity, thermal design and EMC.
  • Ability to interpret schematics and understand engineering intent.

Required skills

  • Altium Designer and Altium 365.
  • PCB layout for mixed‑signal, digital, power and RF designs.
  • Impedance control, grounding, power distribution, thermal management, EMC.
  • High‑speed interfaces: Ethernet, DDR, LVDS, PCIe, JESD204.
  • Component footprint and library creation/validation.
  • Knowledge of PCB fabrication, SMT assembly, DFM/DFA and manufacturing processes.

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Published 2 months ago

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Filtronic

Sedgefield