Process Engineering Manager

About the role

Reporting to the Module Engineering Director, this newly created position supports growth and scale by leading the development, optimisation, and control of manufacturing processes within the module engineering function.

Key responsibilities

• Lead development and qualification of manufacturing processes for module‑level technologies such as Epitaxy, Thin Films, Etch, Photolithography, CMP, Bonding, Coring and Test.
• Provide leadership and coordination for Technical Process Leads, ensuring alignment on standards, priorities and execution across modules.
• Support fab expansion activities, including capacity ramp‑up, line readiness, and installation and commissioning of new equipment.
• Partner with supply‑chain and equipment vendors on tool selection, procurement, installation and qualification.
• Drive continuous improvement and structured problem solving using data‑driven approaches to identify root causes and implement corrective actions.
• Own process performance in production, ensuring stability, repeatability and minimal downtime.

Required profile

• Bachelor’s or Master’s degree in Electrical, Mechanical, Materials or related engineering discipline.
• Proven experience in process engineering within the semiconductor industry.
• Broad technical knowledge across relevant process and module technologies and ability to earn trust of technical leads.
• Demonstrated success driving continuous improvement, yield improvement and root‑cause analysis.
• Strong communication, stakeholder management and team‑building skills.

Required skills

• Epitaxy
• Thin Films
• Etch
• Photolithography
• CMP (Chemical Mechanical Planarisation)
• Bonding
• Coring
• Test
• Process control
• Yield improvement
• Root‑cause analysis

What we offer

• Pension scheme
• Private medical & dental insurance
• 28 days’ holiday + bank holidays
• Free onsite meals
• Onsite gym
• Relocation support
• Visa support available